 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| FS6330 AMERICAN MICROSYSTEMS, INC. LAN Hub Clock Generator IC Preliminary Information Figure 2: Pin Configuration CLKF 1 VSS 2 SEL0 3 20 VDD 19 CLKC 18 CLKA May 2000 1.0 * * * * Features Develops all the high-speed clocks required for LAN Hub applications Clock skew on CLKB1:4 clocks < 250ps Period jitter: 150ps pk-pk typical Available in 20-pin SSOP and TSSOP packages FS6330 X2/REFIN 4 X1 5 VDD 6 VSS 7 SEL1 8 CLKG 9 VDD 10 17 VSS 16 VDD 15 CLKB4 14 CLKB3 13 CLKB2 12 VSS 11 CLKB1 Figure 1: Block Diagram X1 X2/REFIN Control Logic Crystal Oscillator PLL 1 PLL 2 PLL 3 CLKA CLKB1:4 CLKC CLKF CLKG FS6330 Table 1: Frequency Table FONT CRYSTAL SEL1 0 FS6330-01 25MHz 0 1 1 SEL0 0 1 0 1 CLKA 25.000MHz 25.000MHz 25.000MHz 25.000MHz CLKB[1:4] 50.000MHz 50.000MHz 50.000MHz 50.000MHz CLKC 66.667MHz 75.000MHz 83.333MHz 100.000MHz CLKF 100.000MHz 125.000MHz 125.000MHz 100.000MHz CLKG 125.000MHz 125.000MHz 125.000MHz 125.000MHz This document contains information on a preproduction product. Specifications and information herein are subject to change without notice. ISO9001 5.23.00 FS6330 LAN Hub Clock Generator IC Preliminary Information Table 2: Pin Descriptions Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DO = Digital Output; P = Power/Ground; # = Active-low pin AMERICAN MICROSYSTEMS, INC. May 2000 PIN 1 2, 7, 12, 17 3 4 5 6, 10, 16, 20 8 9 11, 13, 14, 15 18 19 TYPE DO P DI U NAME CLKF VSS SEL0 X2/REFIN X1 VDD SEL1 CLKG CLKB1:4 CLKA CLKC Clock Output Ground Clock Select (LSB) DESCRIPTION AO AI P DIU DO DO DO DO Crystal oscillator drive / external reference input Crystal oscillator feedback +3.3V power supply Clock Select (MSB) Clock Output Four clock outputs Clock Output Clock Output 2.0 Electrical Specifications Table 3: Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability. PARAMETER Supply Voltage (VSS = ground) Input Voltage, dc Output Voltage, dc Input Clamp Current, dc (VI < 0 or VI > VDD) Output Clamp Current, dc (VI < 0 or VI > VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) SYMBOL VDD VI VO IIK IOK TS TA TJ MIN. VSS-0.5 VSS-0.5 VSS-0.5 -50 -50 -65 -55 MAX. 7 VDD+0.5 VDD+0.5 50 50 150 125 125 260 2 UNITS V V V mA mA C C C C kV CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 4: Operating Conditions PARAMETER Supply Voltage Operating Temperature Range SYMBOL VDD TA No airflow CONDITIONS/DESCRIPTION MIN. 3.135 0 TYP. 3.3 MAX. 3.465 70 UNITS V C 5.23.00 2 FS6330 AMERICAN MICROSYSTEMS, INC. LAN Hub Clock Generator IC Preliminary information May 2000 Table 5: DC Electrical Specifications Unless otherwise stated, all power supplies = 3.3V 5%, no load on any output, and ambient temperature range TA = 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not currently production tested to any specific limits. MIN and MAX characterization data are 3 f rom typical. Negative currents indicate current flows out of the device. PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs X1 Crystal Oscillator Feedback Threshold Bias Voltage High-Level Input Current Low-Level Input Current Crystal Loading Capacitance * Input Loading Capacitance * X2 Crystal Oscillator Drive High Level Output Source Current Low Level Output Sink Current Clock Outputs High-Level Output Source Current Low-Level Output Sink Current Output Impedance Short Circuit Output Source Current Short Circuit Output Sink Current SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS IDD All 3.3V supplies = 3.465V mA VTH IIH IIL CL(xtal) CL(XIN) VIH = 3.3V VIL = 0V As seen by an external crystal connected to XIN and XOUT As seen by an external clock driver on XOUT; XIN unconnected 13.5 0.5VDD 32 -32 18 36 22.5 V A A pF pF IOH IOL IOH IOL zO IOSH IOSL VI = 3.3V, VO = 0V VI = 0V, VO = 3.3V VO = 2.4V VO = 0.4V Measured at 1.5V VO = 0V; shorted for 30s, max. VO = 3.3V; shorted for 30s, max. -8 9 mA mA mA mA mA mA Table 6: AC Timing Specifications Unless otherwise stated, all power supplies = 3.3V, no load on any output, and ambient temperature TA = 25C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not currently production tested to any specific limits. MIN and MAX characterization data are 3 f rom typical. Spread spectrum modulation is disabled except for Rise/Fall time measurements. PARAMETER Clock Outputs Duty Cycle * Clock Skew * Jitter, Long Term (y( )) * Jitter, Period (peak-peak) * Rise Time * Fall Time * SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS dt tsk(o) tj(LT) tj(P) tr tf Ratio of high pulse width to one clock period, measured at 1.5V CLKB1 to CLKB4 at 1.5V On rising edges 500s apart at 1.5V relative to an ideal clock, CL=15pF, all PLLs active From rising edge to rising edge at 1.5V, CL=15pF, all PLLs active Measured @ 0.4V - 2.4V; CL=15pF Measured @ 2.4V - 0.4V; CL=15pF 45 55 250 % ps ps 150 1.2 1.2 ps ns ns 5.23.00 3 FS6330 LAN Hub Clock Generator IC Preliminary Information AMERICAN MICROSYSTEMS, INC. May 2000 3.0 Package Information Table 7: 20-pin SSOP (5.3mm) Package Dimensions DIMENSIONS INCHES MIN. A A1 A2 b c D E E1 e L 0.002 0.065 0.009 0.0004 0.272 0.291 0.197 0.0098 0.295 0.323 0.220 MAX. 0.079 0.073 MILLIMETERS MIN. 0.05 1.65 0.22 0.09 6.90 7.40 5.00 MAX. 2.0 1.85 0.38 0.25 7.50 8.20 5.60 A2 A c L 1 20 E1 E AMERICAN MICROSYSTEMS, INC. b e 0.0255 BSC 0.022 0 0.037 8 0.65 BSC 0.55 0 0.95 8 BASE PLANE D SEATING PLANE A1 Table 8: 20-pin SSOP (5.3mm) Package Characteristics PARAMETER Thermal Impedance, Junction to Free-Air Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk Lead Capacitance, Mutual SYMBOL JA L11 L12 C11 C12 CONDITIONS/DESCRIPTION Air flow = 0 m/s Longest trace Shortest trace Longest trace to first adjacent trace Shortest trace to first adjacent trace Longest trace to VSS Shortest trace to VSS Longest trace to first adjacent trace Shortest trace to first adjacent trace TYP. 110 2.260 0.958 0.848 0.408 0.395 0.209 0.163 0.057 UNITS C/W nH nH pF pF 5.23.00 4 FS6330 AMERICAN MICROSYSTEMS, INC. LAN Hub Clock Generator IC Preliminary information May 2000 Table 9: 20-pin TSSOP (4.4mm) Package Dimensions DIMENSIONS INCHES MIN. A A1 A2 b c D E E1 e L S 1 2 3 0.002 0.031 0.007 0.0035 0.252 0.169 0.022 0.0078 0 MAX. 0.047 0.006 0.041 0.012 0.0078 0.260 0.177 0.037 8 MILLIMETERS MIN. 0.05 0.80 0.19 0.09 6.40 4.30 0.45 0.20 0 MAX. 1.2 0.15 1.05 0.30 0.20 6.60 4.50 b e A2 D BASE PLANE SEATING PLANE E1 E AMERICAN MICROSYSTEMS, INC. 0.252 BSC 0.0255 BSC 6.40 BSC 0.65 BSC 0.75 8 S A c L 2 A1 3 1 12 REF 12 REF 12 REF 12 REF Table 10: 20-pin SSOP (4.4mm) Package Characteristics PARAMETER Thermal Impedance, Junction to Free-Air Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk Lead Capacitance, Mutual SYMBOL JA L11 L12 C11 C12 CONDITIONS/DESCRIPTION Air flow = 0 m/s Longest trace Shortest trace Longest trace to first adjacent trace Shortest trace to first adjacent trace Longest trace to VSS Shortest trace to VSS Longest trace to first adjacent trace Shortest trace to first adjacent trace TYP. 95 1.680 0.701 0.606 0.248 0.306 0.184 0.110 0.043 UNITS C/W nH nH pF pF 5.23.00 5 FS6330 LAN Hub Clock Generator IC Preliminary Information AMERICAN MICROSYSTEMS, INC. May 2000 4.0 4.1 Ordering Information Device Ordering Codes ORDERING CODE 11825-807 FS6330-01 20-pin TSSOP 0 C to 70 C (Commercial) Tape and Reel PACKAGE TYPE 20-pin SSOP OPERATING TEMPERATURE RANGE 0 C to 70 C (Commercial) SHIPPING CONFIGURATION Tape and Reel DEVICE NUMBER 5.0 Revision Information DATE PAGE DESCRIPTION Modified device pinout to add SELECT inputs for CLKC and CLKF 1,2 Changed CLKA and CLKF pin locations. Changed frequency table for CLKF Upgraded data sheet to Preliminary Information, added SSOP Ordering Code March 17, 2000 March 27, 2000 May 23, 2000 Copyright (c) 2000 American Microsystems, Inc. Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: tgp@amis.com 5.23.00 6 |
Price & Availability of FS6330-01
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |